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Black Android Stencil BGA Reballing MSM8674 CPU – Qianli QL13

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₹175.00

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Upgrade your BGA reballing and soldering accuracy with this premium stainless steel stencil, designed for precise solder paste application on MSM8674 CPU and similar chips. Perfect for mobile phone motherboard repairs, gaming consoles, and other electronics requiring precision soldering.

Features:

  • High-Precision Apertures: Ensures perfect alignment with PCB solder pads for uniform solder application.
  • Premium Stainless Steel Build: Heat-resistant, warp-resistant, and corrosion-resistant for long-lasting use.
  • Versatile Usage: Ideal for BGA reballing and surface-mount device (SMD) assembly.
  • Specific Model Compatibility: Perfect fit for MSM8674 CPU and compatible PCBs.
  • Strong Solder Joints: Reduces errors, minimizing rework for professional-grade results.
  • Efficient Workflow: Speeds up solder paste application and improves repair accuracy.
  • Trusted by Technicians: Preferred by mobile and electronics repair experts for consistent precision.

How to Use:

  1. Position the stencil over the PCB/component.
  2. Apply solder paste evenly with a scraper.
  3. Remove the stencil carefully to expose paste-applied pads.
  4. Use a reflow soldering process for a strong bond.

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Black Android Stencil BGA Reballing MSM8674 CPU – Qianli QL13
₹175.00 ₹0.00
₹175.00