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Black Android Stencil for MDM660 CPU Reballing – Qianli QL14

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₹175.00

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Enhance your soldering and reballing precision with this high-quality stainless steel stencil, designed for accurate solder paste application on PCB pads. Ideal for mobile phone motherboards, BGA chips, and other electronics repair tasks.

Features:

  • High-Precision Apertures: Perfectly aligns with PCB solder pads for uniform solder application.
  • Premium Stainless Steel Build: Heat-resistant, warp-resistant, and corrosion-resistant for long-term durability.
  • Versatile Usage: Suitable for SMD assembly and BGA reballing.
  • Compatible with Specific Models: Ensures a precise fit for various chipsets and circuit boards.
  • Stronger Solder Joints: Minimizes errors and rework for professional-quality soldering.
  • Improves Efficiency: Speeds up solder paste application and increases repair accuracy.
  • Trusted by Technicians: Preferred by experts in mobile and electronics repair for consistent results.

How to Use:

  1. Place the stencil over the PCB/component.
  2. Apply solder paste evenly using a scraper.
  3. Carefully remove the stencil to reveal paste-applied pads.
  4. Perform reflow soldering for a secure bond.

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Black Android Stencil for MDM660 CPU Reballing – Qianli QL14
₹175.00 ₹0.00
₹175.00