The Lanrui K9 15ml Thixotropic Micro-Soldering Paste is a high-grade chemical welding compound engineered specifically for delicate jumper wire routing, fingerprint flex reconstruction, battery terminal replacement, and USB charging dock tail-plug rework. Standard liquid fluxes and low-viscosity solder pastes often run uncontrollably under hot air or iron contact, creating unwanted solder bridges across microscopic 0.01mm jumper tracks or contaminating adjacent gold-plated connectors. The Lanrui K9 solves this by utilizing an advanced thixotropic de-sulfurization formulation that remains firm and stationary until mechanical shear or focused thermal energy is applied.

Packaged in a convenient 15ml dispenser, this paste provides exceptional viscosity stability, preventing slumping or unwanted spreading during precision pad micro-soldering. The active de-sulfurization agents clear oxidation off stubborn copper traces and tarnished connector terminals, ensuring instant solder wetting and strong intermetallic bond formation. It leaves behind a minimal, clear, non-corrosive residue that reduces post-repair wash times while safeguarding fragile circuit tracks from electrolytic degradation. Built for high thermal stability under direct soldering iron tips and focused hot air nozzles, the Lanrui K9 is an indispensable micro-soldering consumable available at Fixtools.

Key Features

1. Thixotropic Anti-Slump Formulation: Maintains stable paste geometry without running or bleeding into adjacent micro-tracks during heating.
2. Active De-Sulfurization & De-Oxidation: Cleans surface oxidation instantly, ensuring bright, mirror-like solder wetting on aged copper pads and nickeled terminals.
3. Engineered for Micro-Jumper Routing: Provides controlled adhesion for microscopic 0.01mm–0.02mm flying jumper wires and fingerprint sensor flex traces.
4. Clean Solder Joints & High Conductivity: Delivers high electrical conductivity with minimal resistance across critical power and signal lines.
5. Low-Residue & Non-Corrosive: Leaves negligible, non-conductive transparent residue that cleans off effortlessly with Isopropyl Alcohol (IPA).
6. High-Temperature Thermal Stability: Resists premature boiling, splattering, or solder-ball scatter under both hot air rework stations and direct iron tips.
7. Versatile Terminal Servicing: Ideal for high-stress solder points such as battery FPC holders, charging ports (tail plugs), and camera socket pins.

Specifications

1. Brand: Lanrui
2. Model / Series: K9 Series
3. Product Name: Lanrui K9 Thixotropic Solder Paste
4. Product Type: Thixotropic De-Sulfurization Micro-Soldering Paste
5. Net Volume: 15 ml
6. Formulation Feature: Thixotropic Rheology (Shear-Thinning, Anti-Running)
7. Active Properties: De-Sulfurization, Surface De-Oxidation, High Wetting Activity
8. Residue Type: Mild, Low-Residue, Non-Corrosive Post-Solder Film
9. Thermal Application: Compatible with C115 / C210 / C245 Soldering Irons & SMD Hot Air Guns
10. Application Range: Fingerprint Sensor Flying Jumper Lines, Battery Connector Sockets, Type-C / Lightning Tail Plug Soldering, BGA Micro-Trace Repair, SMD Connector Rework

Package Includes

1. 1 × Lanrui K9 15ml Thixotropic Micro-Soldering Paste

Important Notice & Terms

Important Advisory: Please ensure full technical compatibility and model verification before confirming your order. Products listed are sold under a strict No Return, No Exchange, and No Refund policy. Limited technical support is offered where feasible and cannot be guaranteed for every application. Fixtools is not liable for incorrect ordering or damage caused by improper usage; purchasing decisions rest entirely with the customer.