Mechanic / Amaoe 6S/6SP Universal BGA Reballing Stencil for iPhone 6S / 6S Plus A9 CPU

(0) 0 Reviews 0 Orders 0 Wish listed

₹99.00

Quantity :

Total price :

(Tax : )

Overview
Reviews

The Mechanic / Amaoe 6S/6SP Stencil is a high-quality reballing tool specifically designed for iPhone 6S and 6S Plus A9 CPUs. Built with precision Japanese steel, this stencil delivers durability, accuracy, and consistency for mobile repair engineers. Its square-hole aperture design ensures perfect solder ball placement, making it ideal for CPU, GPU, and other BGA chip reballing tasks.

Key Features:
🔹 Premium BGA stencil for iPhone 6S/6S Plus A9 CPU
🔹 Made from Japanese super hard steel sheet
🔹 Re-usable and resistant to high temperatures
🔹 Square aperture design for accurate solder application
🔹 0.12mm thin profile for professional-grade precision

Product Specifications:
Model: 6S/6SP Stencil
Material: Japanese Steel Sheet
Thickness: 0.12mm
Hole Type: Square
Re-usable: Yes
Application: CPU / RAM / SMD Reballing

How to Use:

Clean the target component (CPU/IC) thoroughly.
Place the stencil over the component pads.
Apply solder paste evenly across the stencil.
Heat with reflow tools and remove stencil after soldering.

Packing Details:
1 × Mechanic / Amaoe 6S/6SP Stencil
1 × Usage Instructions (if applicable)

Why Choose Mechanic / Amaoe 6S/6SP Stencil?
This stencil is a trusted solution for precision reballing of iPhone 6S / 6S Plus A9 CPUs. With superior build quality, accurate design, and long-lasting durability, it is the perfect choice for professional mobile repair technicians.

Supported Model:
iPhone 6S / 6S Plus – A9 CPU