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Mechanic GW50 Solder Paste 217°C for BGA Tin Planting & PCB Repair (50g)

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₹285.00

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High-quality 217°C solder paste designed for BGA tin planting, CPU reballing, and mobile phone PCB repair. Provides strong, stable joints with excellent oxidation resistance and long-lasting performance.

Key Features:

  • Premium quality, high-purity solder paste
  • 217°C melting point for reliable soldering
  • Strong oxidation & seismic resistance
  • No-clean formula, minimal residue
  • Smooth application, easy to use
  • Lead-free & eco-friendly composition

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Mechanic GW50 Solder Paste 217°C for BGA Tin Planting & PCB Repair (50g)
₹285.00 ₹0.00
₹285.00