The MECHANIC Heat Kit Intelligent Reflow Soldering Heating Platform is a professional-grade tool designed specifically for iPhone X to 13Pro Max PCB motherboard repairs. Engineered for mobile repair technicians, this platform provides precise, controlled, and safe heating for soldering and reflowing delicate components. Its intelligent temperature control ensures a stable heat environment, reducing the risk of motherboard damage during repairs.

Equipped with real-time temperature monitoring, technicians can adjust settings accurately for efficient, targeted soldering. The platform includes specialized nozzles that direct heat precisely onto components, ensuring consistent and safe reflow soldering. Its portable and durable design makes it ideal for repair shops, technicians on-the-go, and professionals seeking reliable and high-performance tools for mobile motherboard repair.

Key Features:

• Intelligent temperature control for stable and safe heating
• Real-time temperature feedback with precision monitoring
• Specialized adjustable nozzles for targeted soldering and reflow
• Suitable for iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max, 12, 12 Pro, 12 Pro Max, 13, 13 Pro, 13 Pro Max motherboards
• Compact and portable design for professional repair use
• Durable construction for daily professional use
• Ensures fast, efficient, and precise PCB repairs without damage

Why Buy:
Trusted by mobile repair professionals, the MECHANIC Heat Kit Intelligent Reflow Soldering Platform is the ultimate tool for iPhone motherboard repair. Its advanced heating technology, precise control, and portability make it an essential addition to any mobile repair toolkit.