MECHANIC IPX3 XG-50 183°C 35G PPD Solder Paste (New Packing, 100% Original)

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The MECHANIC IPX3 XG-50 PPD Solder Paste is a premium-quality tin cream flux paste with a melting point of 183°C, designed for high-precision soldering applications. Formulated with Sn63/Pb37 alloy and advanced no-clean flux, it ensures strong bonding, smooth application, and reliable conductivity for PCB, SMD, BGA, and IC rework. With its high viscosity and fine particle size, it delivers consistent performance for mobile repair, computer servicing, and professional electronics work.

Key Features:

Original Quality – 100% genuine MECHANIC XG-50 solder paste in new packing.
Optimal Alloy Composition – Sn63/Pb37 with particle size 24–45µm, MESH -325+500.
Precise Temperature Control – 183°C melting point suitable for PCB, IC, SMD, and BGA soldering.
No-Clean Formula – Leaves minimal residue, easy to clean, non-corrosive to PCBs.
High Performance – Excellent wetting, spreading, and bonding strength.
Wide Applications – Perfect for mobile phone motherboards, digital electronics, computer chips, and reballing tasks.
Durable & Reliable – Advanced insulation technology with stable viscosity and storage life.

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