The Mechanic S24-22 Stencil is a high-precision BGA reballing stencil designed for Mediatek (MTK) and Qualcomm Snapdragon processors. Manufactured with durable stainless steel, this stencil ensures accuracy, heat resistance, and long-lasting use. Perfect for mobile repair engineers, it allows precise application of solder paste or solder balls during chip-level servicing, ensuring professional reballing results.

Key Features:
🔹 Specially designed stencil for MTK & Snapdragon IC chip reballing
🔹 Premium stainless steel build for durability and reusability
🔹 High precision apertures for accurate solder deposition
🔹 Heat-resistant, non-deforming under repeated use
🔹 Essential tool for advanced mobile repairing and IC-level servicing

Product Specifications:
Model: Mechanic S24-22
Material: Stainless Steel
Type: BGA Reballing Stencil
Thickness: Approx. 0.12mm
Application: Processor IC Reballing (MTK & Qualcomm Snapdragon)

How to Use:

1. Clean the IC or PCB pads before starting reballing.
2. Place the stencil securely over the IC.
3. Apply solder paste or solder balls evenly.
4. Use a hot air rework station to heat and set solder.
5. Remove the stencil after cooling for a clean finish.

Packing Details:
1 × Mechanic S24-22 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-22 Stencil?
✅ Trusted Mechanic quality for chip-level repairs
✅ Compatible with both Mediatek and Snapdragon processors
✅ Precision reballing with consistent results
✅ Strong, reusable, and high-temperature resistant
✅ Professional choice for mobile repair engineers

Supported Models:

• MT6757V
• MT6771V
• MT6763V
• MT6739V
• SDM660
• SDM710
• SDM845 A
• SDM845 B