Mechanic S24-25 Universal BGA Reballing Stencil for MSM8996 CPU

Mechanic S24-25 Universal BGA Reballing Stencil for MSM8996 CPU – LG G5/G6 / V20 Series

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₹99.00

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Overview
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The Mechanic S24-25 Stencil is a professional-grade BGA reballing stencil designed for LG smartphones using MSM8996 CPUs. Crafted from premium stainless steel, it provides precise solder placement, durability, and heat resistance. Ideal for mobile repair technicians, this stencil ensures efficient and accurate IC chip reballing, reducing errors and saving time.

Key Features:
🔹 Compatible with MSM8996 CPU and LG devices
🔹 High-precision aperture design for accurate solder application
🔹 Premium stainless steel construction for durability and reusability
🔹 Resistant to high-temperature soldering without warping
🔹 Perfect for professional mobile repair, BGA reballing, and IC chip replacement

Product Specifications:
Model: Mechanic S24-25
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Thickness: Approx. 0.12mm
Application: MSM8996 CPU IC chip reballing

How to Use:

Clean the IC or PCB pads thoroughly.
Align the stencil correctly over the IC.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure the solder.
Remove the stencil after cooling for a clean reballing result.

Packing Details:
1 × Mechanic S24-25 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-25 Stencil?
✅ Designed specifically for LG smartphones with MSM8996 CPU
✅ Ensures professional, precise, and reliable BGA reballing
✅ Durable, reusable, and heat-resistant
✅ Trusted by mobile repair professionals for accurate IC work

Supported Models: