Mechanic S24-26 Universal BGA Reballing Stencil for MSM8998 CPU

Mechanic S24-26 Universal BGA Reballing Stencil for MSM8998 CPU – LG V30/V30P/V30S Series

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Overview
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Detail Description

The Mechanic S24-26 Stencil is a high-precision BGA reballing stencil crafted for LG smartphones powered by MSM8998 CPUs. Made from durable stainless steel, it ensures precise solder application, heat resistance, and repeated use. Ideal for mobile repair professionals, this stencil allows fast and accurate IC chip reballing, reducing errors and improving repair efficiency.

Key Features:
🔹 Designed for LG V30, V30P, V30S, V30S+, and H930DS models
🔹 High-precision aperture design for accurate solder placement
🔹 Premium stainless steel material for durability and long life
🔹 Heat-resistant, maintaining shape during high-temperature soldering
🔹 Professional mobile repair tool for reliable BGA reballing and IC chip replacement

Product Specifications:
Model: Mechanic S24-26
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Thickness: Approx. 0.12mm
Application: MSM8998 CPU IC chip reballing

How to Use:

Clean the PCB or IC pads before starting.
Align the stencil carefully over the target IC.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure solder placement.
Remove the stencil after cooling for a clean and precise result.

Packing Details:
1 × Mechanic S24-26 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-26 Stencil?
✅ Professional-grade stencil for LG MSM8998 CPU smartphones
✅ Ensures precise, fast, and reliable BGA reballing
✅ Durable, reusable, and heat-resistant design
✅ Trusted by mobile repair technicians for accuracy and efficiency

Supported Models: