Mechanic S24-27 Universal BGA Reballing Stencil for MTK CPU / R9 / A37 / A59 / Y67 Series

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Overview
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The Mechanic S24-27 Stencil is a precision BGA reballing stencil designed for accurate solder application on mobile PCB pads. Made from high-quality stainless steel, it ensures durability, heat resistance, and long-term use. Ideal for professional mobile repair technicians, it provides fast, reliable, and precise IC chip reballing for MTK CPUs and related smartphone series.

Key Features:
🔹 High-precision aperture design for accurate solder paste placement
🔹 Made from durable stainless steel for repeated use
🔹 Heat-resistant, maintaining shape during high-temperature soldering
🔹 Ensures fast, safe, and reliable BGA reballing
🔹 Professional mobile repair tool for MTK CPU IC chip replacement

Product Specifications:
Model: Mechanic S24-27
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Thickness: Approx. 0.12mm
Application: Mobile IC chip reballing

How to Use:

Clean the PCB or IC pads before starting.
Align the stencil carefully over the target IC.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure solder placement.
Remove the stencil after cooling for a clean and precise result.

Packing Details:
1 × Mechanic S24-27 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-27 Stencil?
✅ Professional-grade stencil for precise IC reballing
✅ Durable, reusable, and heat-resistant
✅ Trusted by mobile repair technicians for accurate results
✅ Ensures fast, reliable, and efficient solder placement

Supported Model:
MT6755V / 6750V, R9, A37, A59, Y67 Series
Noblue 3 / 3S / 5 / 6