Mechanic S24-29 Universal BGA Reballing Stencil for MSM8916 / 8939 / 8940 CPU / OPPO & VIVO Series

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Overview
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The Mechanic S24-29 Stencil is a professional-grade BGA reballing stencil designed for precise solder paste application on mobile PCB pads. Crafted from durable stainless steel, it offers excellent heat resistance and long-term usability. Ideal for mobile repair technicians, it ensures fast, accurate, and reliable IC reballing for MSM8916, 8939, 8940 CPUs and compatible OPPO & VIVO devices.

Key Features:
🔹 Precision aperture design for accurate solder paste or ball placement
🔹 Made from high-quality stainless steel for repeated use
🔹 Heat-resistant, maintaining shape during high-temperature soldering
🔹 Enables fast, safe, and reliable BGA reballing
🔹 Perfect for professional mobile repair of OPPO & VIVO smartphones

Product Specifications:
Model: Mechanic S24-29
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Thickness: Approx. 0.12mm
Application: Mobile IC chip reballing

How to Use:

Clean the PCB or IC pads before starting.
Align the stencil carefully over the target IC.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure solder placement.
Remove the stencil after cooling for a clean and precise result.

Packing Details:
1 × Mechanic S24-29 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-29 Stencil?
✅ Professional-grade stencil for precise IC reballing
✅ Durable, reusable, and heat-resistant
✅ Trusted by mobile repair technicians for accurate results
✅ Ensures fast, reliable, and efficient solder placement

Supported Model:
MSM8916 / 8939 / 8940 CPU
OPPO & VIVO Smartphones