Mechanic S24-30 Universal BGA Reballing Stencil for Qualcomm PM / MTK MI-POWER CPUs

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Overview
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The Mechanic S24-30 Stencil is a high-precision BGA reballing stencil designed for professional mobile repair. Made from durable stainless steel, it ensures precise solder paste or ball placement for Qualcomm PM series and MTK MI-POWER CPUs. Perfect for technicians, it delivers fast, accurate, and reliable reballing for a wide range of mobile processors.

Key Features:
🔹 Precision aperture design for accurate solder placement on BGA pads
🔹 High-quality stainless steel construction for repeated use
🔹 Heat-resistant and durable under high-temperature soldering
🔹 Enables fast, safe, and reliable BGA reballing
🔹 Compatible with multiple Qualcomm PM and MTK MI-POWER models

Product Specifications:
Model: Mechanic S24-30
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Thickness: Approx. 0.12mm
Application: Mobile IC chip reballing

How to Use:

Clean the PCB or IC pads before use.
Align the stencil over the target IC precisely.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure solder placement.
Remove the stencil carefully for a clean, precise finish.

Packing Details:
1 × Mechanic S24-30 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-30 Stencil?
✅ Professional-grade stencil for accurate IC reballing
✅ Durable, reusable, and heat-resistant
✅ Trusted by mobile repair technicians for reliable results
✅ Ensures fast, efficient, and precise solder placement

Supported Model:
Qualcomm PM / MTK MI-POWER CPUs
PM660, PM670, PM845, PM540, PM632, PM640, PM660A-L, PM670A-L
MT6355W, MT6356W, MT6357V-CRV, MT6358W, MT6336WP, MT6370P, MT6371P

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