Mechanic S24-31 Universal BGA Reballing Stencil for Exynos 8895 / MSM8998 / Samsung S8/S8+ / Note8

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Overview
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Detail Description

The Mechanic S24-31 Stencil is a professional-grade BGA reballing stencil for mobile repair technicians. Designed with precise apertures and high-quality stainless steel, it ensures accurate solder paste or solder ball placement for Exynos 8895, MSM8998 CPUs, and Samsung S8/S8+/Note8 series. Perfect for fast, safe, and reliable reballing.

Key Features:
🔹 Precision aperture design for accurate solder application on BGA pads
🔹 Durable stainless steel construction for repeated high-temperature use
🔹 Ensures fast, safe, and reliable IC reballing
🔹 Compatible with multiple Samsung and CPU models
🔹 Easy to align and use for professional mobile repair

Product Specifications:
Model: Mechanic S24-31
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Application: Mobile IC chip reballing

How to Use:

Clean the PCB or IC pads before use.
Align the stencil over the target IC carefully.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure solder placement.
Remove the stencil carefully for a clean and precise result.

Packing Details:
1 × Mechanic S24-31 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-31 Stencil?
✅ Professional-grade stencil for precise IC reballing
✅ Durable, reusable, and heat-resistant
✅ Trusted by mobile repair technicians for reliable results
✅ Ensures fast, efficient, and accurate solder placement

Supported Model:
Exynos 8895, MSM8998 CPU
Samsung S8/S8+, Note8
G9500, G955U, N9500