Mechanic S24-31 Universal BGA Reballing Stencil for Exynos 8895 / MSM8998 / Samsung S8/S8+ / Note8

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₹99.00

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The Mechanic S24-31 Stencil is a professional-grade BGA reballing stencil for mobile repair technicians. Designed with precise apertures and high-quality stainless steel, it ensures accurate solder paste or solder ball placement for Exynos 8895, MSM8998 CPUs, and Samsung S8/S8+/Note8 series. Perfect for fast, safe, and reliable reballing.

Key Features:
🔹 Precision aperture design for accurate solder application on BGA pads
🔹 Durable stainless steel construction for repeated high-temperature use
🔹 Ensures fast, safe, and reliable IC reballing
🔹 Compatible with multiple Samsung and CPU models
🔹 Easy to align and use for professional mobile repair

Product Specifications:
Model: Mechanic S24-31
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Application: Mobile IC chip reballing

How to Use:

  1. Clean the PCB or IC pads before use.
  2. Align the stencil over the target IC carefully.
  3. Apply solder paste or solder balls through the stencil apertures.
  4. Heat with a rework station to secure solder placement.
  5. Remove the stencil carefully for a clean and precise result.

Packing Details:
1 × Mechanic S24-31 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-31 Stencil?
Professional-grade stencil for precise IC reballing
Durable, reusable, and heat-resistant
Trusted by mobile repair technicians for reliable results
Ensures fast, efficient, and accurate solder placement

Supported Model:
Exynos 8895, MSM8998 CPU
Samsung S8/S8+, Note8
G9500, G955U, N9500

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Mechanic S24-31 Universal BGA Reballing Stencil for Exynos 8895 / MSM8998 / Samsung S8/S8+ / Note8
₹99.00 ₹0.00
₹99.00