Mechanic S24-32 Universal BGA Reballing Stencil for Exynos 8890 / MSM8996 / Samsung S7 Series

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₹99.00

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Overview
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The Mechanic S24-32 Stencil is a high-precision BGA reballing stencil designed for professional mobile repair. Crafted with durable stainless steel, it ensures accurate solder paste or solder ball placement on Exynos 8890 and MSM8996 CPUs, supporting the Samsung S7 series. Ideal for fast, reliable, and safe reballing.

Key Features:
🔹 Precision aperture design for accurate solder application on BGA pads
🔹 Durable stainless steel construction for repeated high-temperature use
🔹 Fast, safe, and reliable IC reballing
🔹 Compatible with multiple Samsung S7 models
🔹 Easy to align and use for professional mobile repair

Product Specifications:
Model: Mechanic S24-32
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Application: Mobile IC chip reballing

How to Use:

Clean the PCB or IC pads before use.
Align the stencil over the target IC carefully.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure solder placement.
Remove the stencil carefully for a clean and precise result.

Packing Details:
1 × Mechanic S24-32 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-32 Stencil?
✅ Professional-grade stencil for precise IC reballing
✅ Durable, reusable, and heat-resistant
✅ Trusted by mobile repair technicians for reliable results
✅ Ensures fast, efficient, and accurate solder placement

Supported Model:
Exynos 8890, MSM8996 CPU
Samsung S7 Series: G9300, G9350, G9308, G930F