Mechanic S24-33 Universal BGA Reballing Stencil for Exynos 7420 / Samsung S6/S6+ / Note5 Series

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Overview
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The Mechanic S24-33 Stencil is a precision BGA reballing stencil designed for professional mobile repair. Made from durable stainless steel, it ensures accurate solder paste or solder ball placement for Exynos 7420 CPUs, supporting Samsung S6, S6 Plus, and Note5 models. Perfect for fast, reliable, and professional IC reballing.

Key Features:
🔹 High-precision aperture design for accurate solder application
🔹 Durable stainless steel construction for repeated use
🔹 Ensures safe, fast, and reliable reballing process
🔹 Compatible with multiple Samsung S6/S6+ and Note5 models
🔹 Easy to align and use for professional mobile repair

Product Specifications:
Model: Mechanic S24-33
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Application: Mobile IC chip reballing

How to Use:

Clean the PCB or IC pads before use.
Align the stencil over the target IC carefully.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure solder placement.
Remove the stencil carefully for a clean and precise result.

Packing Details:
1 × Mechanic S24-33 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-33 Stencil?
✅ Professional-grade stencil for precise IC reballing
✅ Durable, reusable, and heat-resistant
✅ Trusted by mobile repair technicians for accurate results
✅ Ensures fast, efficient, and reliable solder placement

Supported Model:
Exynos 7420 CPU
Samsung S6 / S6+ / Note5 Series: G9200, G9250, N9200