Mechanic S24-36 Universal BGA Reballing Stencil for MSM8916 / MSM8953 CPU / Samsung C7/J Series

(0) 0 Reviews 0 Orders 0 Wish listed

₹99.00

Quantity :

Total price :

(Tax : )

Overview
Reviews

The Mechanic S24-36 Stencil is a high-precision BGA reballing stencil for accurate solder paste application on mobile IC chips. Made from durable stainless steel, it ensures consistent and professional results for mobile repair professionals. Ideal for Samsung C7, J Series devices, and MSM8916/MSM8953 CPU models.

Key Features:
🔹 Precise aperture design for accurate solder placement
🔹 Durable stainless steel material for repeated use
🔹 Fast, safe, and reliable reballing
🔹 Compatible with Samsung C7, J3, J5, A5, and B01-AB CPU
🔹 Easy to use for professional mobile repair

Product Specifications:
Model: Mechanic S24-36
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Application: Mobile IC chip reballing

How to Use:

Clean PCB or IC pads carefully.
Align the stencil over the target IC.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure the solder.
Remove the stencil for precise solder placement.

Packing Details:
1 × Mechanic S24-36 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-36 Stencil?
✅ Professional-grade stencil for precise IC reballing
✅ Reusable, heat-resistant, and durable
✅ Trusted by mobile repair technicians for accurate results
✅ Ensures fast, efficient, and reliable solder placement

Supported Model:
MSM8916
MSM8953
B01-AB CPU
Samsung C7071 / J610 / C7 / J3 / J5 / A5