Mechanic S24-37 Universal BGA Reballing Stencil for Snapdragon 845 / Exynos 9810 CPU / Samsung S9/S9+

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Overview
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The Mechanic S24-37 Stencil provides high-precision solder paste application for mobile IC chips. Crafted from durable stainless steel, this stencil ensures accurate, reliable, and professional results for mobile repair technicians. Perfectly compatible with Snapdragon 845, Exynos 9810 CPU, and Samsung S9/S9+ series devices.

Key Features:
🔹 Precise aperture design for perfect solder placement
🔹 Durable stainless steel material for repeated use
🔹 Fast, safe, and reliable reballing
🔹 Compatible with Snapdragon 845 and Exynos 9810 CPU
🔹 Easy to use for professional mobile repair

Product Specifications:
Model: Mechanic S24-37
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Application: Mobile IC chip reballing

How to Use:

Clean the PCB or IC pads thoroughly.
Align the stencil over the target IC component.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure the solder.
Remove the stencil for precise IC solder placement.

Packing Details:
1 × Mechanic S24-37 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-37 Stencil?
✅ Professional-grade stencil for accurate IC reballing
✅ Reusable, heat-resistant, and durable
✅ Trusted by mobile repair technicians for reliable results
✅ Ensures fast, efficient, and precise solder placement

Supported Model:
Snapdragon 845
Exynos 9810 CPU
Samsung S9 / S9+