Mechanic S24-38 Universal BGA Reballing Stencil for Qualcomm APQ8084 / Samsung Galaxy Note4

(0) 0 Reviews 0 Orders 0 Wish listed

₹99.00

Quantity :

Total price :

(Tax : )

Overview
Reviews

The Mechanic S24-38 Stencil is designed for precise solder paste application on mobile IC chips. Made from durable stainless steel, it ensures accurate, professional, and reliable reballing results. Perfectly compatible with Qualcomm APQ8084 CPU and Samsung Galaxy Note4 series devices.

Key Features:
🔹 High-precision aperture design for perfect solder placement
🔹 Durable stainless steel material for repeated use
🔹 Fast, safe, and reliable reballing process
🔹 Compatible with Qualcomm APQ8084 CPU and Samsung Galaxy Note4
🔹 Easy to use for professional mobile repair

Product Specifications:
Model: Mechanic S24-38
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Application: Mobile IC chip reballing

How to Use:

Clean the PCB or IC pads thoroughly.
Align the stencil over the target IC component.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure the solder.
Remove the stencil for precise IC solder placement.

Packing Details:
1 × Mechanic S24-38 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-38 Stencil?
✅ Professional-grade stencil for accurate IC reballing
✅ Reusable, heat-resistant, and durable
✅ Trusted by mobile repair technicians for reliable results
✅ Ensures fast, efficient, and precise solder placement

Supported Model:
Qualcomm APQ8084 CPU BGA529
Samsung Galaxy Note4 (EMCP)