Mechanic S24-39 Universal BGA Reballing Stencil for Exynos 7570 / Samsung J1/J2/J3/J4

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Overview
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The Mechanic S24-39 Stencil is a high-precision tool for accurate solder paste application on mobile IC chips. Made from durable stainless steel, it ensures professional, reliable, and repeatable results for reballing. Perfectly compatible with Exynos 7570/3475, SC9830A/7730S CPU, and Samsung J1/J2/J3/J4 series devices.

Key Features:
🔹 Precision aperture design for flawless solder placement
🔹 Durable stainless steel construction for repeated use
🔹 Fast, safe, and reliable reballing process
🔹 Compatible with Exynos CPUs and Samsung J series
🔹 Easy to use for professional mobile repair

Product Specifications:
Model: Mechanic S24-39
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Application: Mobile IC chip reballing

How to Use:

Clean the PCB or IC pads thoroughly.
Align the stencil over the target IC component.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure the solder.
Remove the stencil for precise IC solder placement.

Packing Details:
1 × Mechanic S24-39 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-39 Stencil?
✅ Professional-grade stencil for accurate IC reballing
✅ Reusable, heat-resistant, and durable
✅ Trusted by mobile repair technicians for precise results
✅ Ensures fast, efficient, and clean solder placement

Supported Model:
Exynos 7570/3475, SC9830A/7730S CPU
Samsung J1/J2/J3/J4 (Samsung100H/J2/J320F/G570M)