Mechanic S24-40 Universal BGA Reballing Stencil for Exynos 9820 / Samsung S10/S10+ / Note10

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₹99.00

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Overview
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The Mechanic S24-40 Stencil is a professional-grade tool for accurate solder paste application on mobile IC chips. Crafted from durable stainless steel, it ensures precise and reliable reballing for Exynos 9820, Qualcomm 855, SM8150 CPUs, and Samsung S10/S10+, Note10 series devices. Ideal for mobile repair technicians seeking efficiency and precision.

Key Features:
🔹 High-precision aperture design for accurate solder placement
🔹 Durable stainless steel material for repeated use
🔹 Ideal for reballing BGA chips
🔹 Compatible with Exynos, Qualcomm, and Samsung devices
🔹 Easy to use for professional mobile repair

Product Specifications:
Model: Mechanic S24-40
Material: Stainless Steel
Type: Universal BGA Reballing Stencil
Application: Mobile IC chip reballing

How to Use:

Clean the PCB or IC pads thoroughly.
Align the stencil over the target IC component.
Apply solder paste or solder balls through the stencil apertures.
Heat with a rework station to secure the solder.
Remove the stencil for precise IC solder placement.

Packing Details:
1 × Mechanic S24-40 Stencil
1 × User Guide (if included)

Why Choose Mechanic S24-40 Stencil?
✅ Professional-grade stencil for precise IC reballing
✅ Reusable, heat-resistant, and durable
✅ Trusted by mobile repair technicians
✅ Ensures fast, clean, and efficient solder placement

Supported Model:
Exynos 9820, Qualcomm 855, SM8150
Samsung S10/S10+, Note10 (G9730/G975/G977/N975)