Mechanic S24-41 Universal BGA Reballing Stencil for Exynos 7904 / Qualcomm 710 SDM710 / Samsung J720 / A305 / G8870 / G887 / A40S / A8S

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Overview
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The Mechanic S24-41 Stencil is a premium-quality BGA reballing stencil designed for precise soldering and IC repair. It ensures accurate solder paste application on mobile IC pads, making it an essential tool for mobile phone motherboard repair and chip-level servicing. Built with durable stainless steel, this stencil offers long-lasting performance and reliability for professional technicians.

Key Features:
🔹 High-precision aperture design for clean solder ball placement
🔹 Strong stainless steel material for durability and heat resistance
🔹 Perfect for BGA reballing and IC chip rework
🔹 Compatible with multiple Exynos and Qualcomm CPU models
🔹 Trusted by professional mobile repair engineers

Product Specifications:
Model: Mechanic S24-41
Material: Stainless Steel
Application: IC soldering, BGA reballing, chip-level repair
Type: Universal Mobile IC Reballing Stencil

How to Use:

Place and align the stencil over the IC/PCB.
Apply solder paste or balls through stencil apertures.
Use a hot air rework station to reflow solder.
Carefully remove stencil for clean and precise results.

Supported Models:

Exynos 7904
Qualcomm 710 SDM710
Samsung J720
Samsung A305
Samsung G8870 / G887
Samsung A40S
Samsung A8S

Packing Details:
1 × Mechanic S24-41 Stencil

Why Choose Mechanic S24-41 Stencil?
✅ Precision design ensures accurate soldering
✅ Reusable and resistant to high temperatures
✅ Saves time in IC reballing and repairs
✅ Professional tool for advanced mobile repairing

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