Mechanic S24-49 BGA Reballing Stencil for Huawei Power IC Series

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The Mechanic S24-49 stencil is designed for precise solder paste application and efficient CPU/IC reballing. Made from high-quality stainless steel, it ensures durability, heat resistance, and accuracy in mobile motherboard repair. Specially crafted for Huawei Power IC models, this stencil is an essential tool for professional technicians.

Key Features:

Stainless steel build for long-lasting use
High-temperature resistance for reliable performance
Accurate aperture design for perfect solder ball alignment
Compatible with multiple Huawei IC versions

Supported Models:
H16555 V1 / H16421 A V3,
HI6553 V1 / H16551 V1,
H16555 V2 / H16559 V1,
HI6921 V1 / H16421 GFC,
HI6421 V7 / H16421 V6,
HI6421 B V5 / H16561 V1,
HI6422 V2 / H16523 V1,
HI6522 V2 / H16403 V1,
HI6422 V3 / H16423 V1

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