Mechanic S24-54 BGA Reballing Stencil

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₹99.00

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Mechanic S24-54 stencil provides precise solder paste application for PCB and BGA chip reballing. Crafted from durable stainless steel, it resists high temperatures and ensures consistent, accurate solder placement for Huawei and Honor devices.

Key Features:

  • High-quality stainless steel construction
  • Heat-resistant for repeated soldering
  • Accurate aperture design for precise solder paste deposition
  • Ideal for mobile CPU and BGA chip reballing

Supported Models:
Kirin 930 / 935, HI3630 / 3635 CPU, HUAWEI P8, Mate7 / MTS, HONOR 7 / X2

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Mechanic S24-54 BGA Reballing Stencil
₹99.00 ₹0.00
₹99.00