Mechanic S24-55 BGA Reballing Stencil

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₹99.00

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Mechanic S24-55 stencil ensures precise solder paste application for PCB and BGA chip reballing. Made from durable stainless steel, it withstands high temperatures and provides accurate solder placement for Huawei and Honor devices.

Key Features:

  • Durable stainless steel construction
  • Heat-resistant for repeated use
  • Precise aperture design for accurate solder paste deposition
  • Suitable for mobile CPU and BGA chip reballing

Supported Models:
MSM8916 / 8939, MT6753V CPU, HUAWEI G7 / G8X / 5S, HONOR 7i / 5X

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Mechanic S24-55 BGA Reballing Stencil
₹99.00 ₹0.00
₹99.00