Mechanic S24-56 BGA Reballing Stencil

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₹99.00

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Mechanic S24-56 stencil ensures precise solder paste application for PCB and BGA chip reballing. Made from high-quality stainless steel, it withstands repeated high-temperature use and provides accurate solder placement for Huawei devices.

Key Features:

  • Durable stainless steel construction
  • Heat-resistant for repeated use
  • Precise aperture design for accurate solder paste deposition
  • Ideal for mobile CPU and BGA chip reballing

Supported Models:
Kirin 950 / 955, HI3650 CPU, HUAWEI Mate8 / V8 / Magic

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Mechanic S24-56 BGA Reballing Stencil
₹99.00 ₹0.00
₹99.00