Mechanic S24-57 BGA Reballing Stencil

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₹99.00

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Mechanic S24-57 stencil allows precise solder paste application on PCBs and BGA chips. Its stainless steel construction ensures durability and high-temperature resistance, making it perfect for Huawei and Honor mobile repairs.

Key Features:

  • High-quality stainless steel
  • Heat-resistant for repeated use
  • Accurate aperture design for precise solder paste deposition
  • Ideal for CPU and BGA reballing

Supported Models:
HI6220 / 6250 / MSM8952 CPU, HUAWEI P8 / P9, NOVA / Double 4G Vision, Honor 4X / 4C / 5C / 5A

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Mechanic S24-57 BGA Reballing Stencil
₹99.00 ₹0.00
₹99.00