Mechanic S24-67 BGA Reballing Stencil

Mechanic S24-67 BGA Reballing Stencil

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₹99.00

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Overview
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Mechanic S24-67 stencil enables precise solder paste application on PCB pads and BGA components. Made from durable stainless steel, it is heat-resistant and ideal for CPU reballing and surface-mount device repairs.

Key Features:

High-quality stainless steel construction
Heat-resistant for repeated soldering
Precision aperture design for accurate solder deposition
Perfect for Qualcomm CPU and BGA reballing

Supported Models:
Qualcomm 636 / 660 CPU
REDMI NOTE 5 / 5 Pro
XIAOMI NOTE 3 / 6X

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Mechanic S24-67 BGA Reballing Stencil

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₹99.00