Mechanic S24-93 Qualcomm RF & Connectivity Reballing Stencil

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Overview
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The Mechanic S24-93 stencil enables precise solder paste application for Qualcomm RF and connectivity chips. Crafted from durable stainless steel, this stencil ensures accurate BGA reballing and IC soldering on mobile PCBs and electronic devices, making it a must-have tool for professional repair technicians.

Key Features:

Premium stainless steel construction for repeated use
Precision aperture design for controlled solder paste deposition
Ideal for BGA and IC reballing of Qualcomm RF & connectivity chips
Heat-resistant to withstand high-temperature soldering processes
Ensures reliable and consistent solder connections

Supported Models:
WFR1620, WFR1625-L, WTR3905, WTR3925, WFR2600, WTR4905, WTR4605, WTR1605-L, WTR5975, WTR2605, WTR2100, WTR2955, WTR2965, 0.4-45 / 0.35-45

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