The Mechanic S45-A11 3D Stencil is
a professional-grade tool for precise BGA reballing and IC tin planting.
Featuring a stepped 3D groove design, it allows rapid alignment with the IC
tinning position. The square rounded holes make solder ball removal effortless.
With a high success rate for solder ball formation, this stencil is suitable
for both beginners and experts, ensuring long-lasting durability for repeated
use.
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