High-precision 3D groove BGA
reballing stencil designed specifically for the iPhone A12 CPU series—used in
XS, XS Max, and XR models. Crafted with durable tin steel and featuring an
innovative 3D groove design, this stencil aligns precisely with IC pads,
enabling fast and accurate solder ball placement for high reballing success.
Key Features:
Supported Models:
Compatible with iPhone A12 series, particularly iPhone XS, XS Max, and XR
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