The Mechanic S45-A9 3D Stencil is
a precision tool for BGA reballing, designed to make IC tin planting faster and
more accurate. Its stepped groove design allows rapid alignment with the IC
tinning position, while the square hole layout ensures easy removal of formed
solder balls. This 3D stencil is thicker than standard stencils, providing
durability and long-lasting performance, suitable for both beginners and
experienced technicians.
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