Mechanic Welsolo VS11 Universal Reballing Stencil for PCB & BGA Chip Repair

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Overview
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The Mechanic Welsolo VS11 Stencil is a durable metal tool designed for precise solder paste application and BGA reballing. Ideal for PCB, IC, and motherboard repairs, it ensures accurate solder placement, long-lasting performance, and ease of use. This stencil is perfect for mobile phone repair and supports Qualcomm SDM845 devices.

Key Features:
🔹 Easy to Use – Smooth design for accurate and quick solder paste application.
🔹 High-Quality Metal – Stainless steel construction for durability and repeated use.
🔹 Precision Apertures – Aligns perfectly with PCB pads for controlled solder deposition.
🔹 Reballing Support – Suitable for BGA chip rework and component replacement.
🔹 Universal Compatibility – Supports Qualcomm SDM845 devices for versatile repair.

Supported Model:
Universal Steel Stencil for Qualcomm SDM845

Specifications:
Model: Welsolo VS11
Material: Stainless Steel (Durable & Heat Resistant)
Application: PCB Repair, BGA Reballing, IC/CPU Chip Soldering
Design: Precision aperture layout for accurate solder paste placement

Packing Details:
1 × Mechanic Welsolo VS11 Stencil

Why Choose This?
Mechanic Welsolo VS11 provides professional-grade accuracy and durability for motherboard, BGA, and IC repairs. Its compatibility with Qualcomm SDM845 devices makes it a versatile tool for technicians and mobile repair shops.

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