Mechanic Welsolo VS32 Universal Reballing Stencil for PCB & BGA Chip Repair

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Overview
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The Mechanic Welsolo VS32 Stencil is a high-precision stainless steel tool designed for accurate solder paste application and BGA reballing. Perfect for professional mobile repair technicians, it ensures precise solder placement on ICs and motherboards. Compatible with multiple Exynos and Qualcomm devices, including Samsung Galaxy S7 series.

Key Features:
🔹 Easy to Use – Ensures precise alignment of solder paste with PCB pads.
🔹 Durable Metal Construction – High-quality stainless steel for repeated use.
🔹 Precision Apertures – Deposits controlled solder amounts for accurate repairs.
🔹 Reballing Ready – Perfect for BGA chip repair and IC/CPU replacement.
🔹 Wide Device Support – Works with Exynos8890, MSM8996, and Samsung Galaxy S7 series.

Supported Models:
Exynos8890, MSM8996 CPU, Samsung G9300/G9350/9308/G930F, Universal S7 Series

Specifications:
Model: Welsolo VS32
Material: Stainless Steel (Durable & Heat Resistant)
Application: PCB Repair, BGA Reballing, IC/CPU Chip Soldering
Design: Precision aperture layout for accurate solder paste deposition

Packing Details:
1 × Mechanic Welsolo VS32 Stencil

Why Choose This?
Mechanic Welsolo VS32 ensures precision, durability, and extensive device compatibility for mobile repair professionals. Its robust stainless steel construction supports repeated use without wear, making it ideal for Exynos and Qualcomm Samsung Galaxy S7 repairs.

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