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Qianli Mega Idea BZ26 Universal Stencil 0.3/0.35/0.4/0.5 BGA Reballing Stencil

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₹289.00

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High-precision universal stencil designed for BGA reballing with multiple ball sizes (0.3/0.35/0.4/0.5mm). Ideal for solder paste application on various PCBs and BGA chips. Ensures precise solder deposition for professional-grade connections. Made from durable stainless steel to withstand repeated use and high-temperature soldering.

Key Features:

  • Supports multiple BGA ball sizes: 0.3, 0.35, 0.4, 0.5 mm
  • Universal design compatible with various devices and PCBs
  • Durable stainless steel construction
  • Facilitates accurate solder paste application and reballing
  • Reduces errors and rework for precise solder joints
  • Easy to clean and reuse

Supported Models:
Universal stencil compatible with various BGA chips and PCB layouts

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Qianli Mega Idea BZ26 Universal Stencil 0.3/0.35/0.4/0.5 BGA Reballing Stencil
₹289.00 ₹0.00
₹289.00