The QianLi Mega-Idea QL-01 Black Stencil is a
high-precision tool designed for soldering and reballing Oppo and Vivo
smartphone motherboards. Perfect for mobile repair technicians, this stencil
ensures accurate application of solder paste or solder balls for professional
results.
Features:
- Precise
Solder Application: Allows accurate placement of solder paste on PCB
solder pads.
- Reballing
Ready: Ideal for re-soldering BGA components on Oppo and Vivo devices.
- High-Precision
Apertures: Tiny holes align with PCB pads for uniform solder
deposition.
- Durable
Material: Made from stainless steel for heat resistance,
longevity, and repeated use.
- Professional
Use: Trusted by technicians for consistent, reliable performance.
Supported Models:
- SDM
660 CPU
- Oppo
R11
- Vivo
X20
- Mi
Note 3
How to Use:
- Place
the stencil over the PCB/component.
- Apply
solder paste evenly with a scraper.
- Remove
the stencil carefully to reveal the solder-applied pads.
- Reflow
solder the component for a secure connection.