High-precision stencil designed for accurate solder paste
application on Oppo and Vivo motherboard pads. Ideal for soldering and
reballing processes, ensuring components like BGA chips are placed and soldered
with precision. Made from durable stainless steel to withstand repeated use and
high-temperature soldering.
Key Features:
Supported Models:
Designed for various compatible Oppo and Vivo devices; typically matches
component layouts of specific PCB series.
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