The QianLi Mega-Idea QL-03 Black Stencil is a
professional-grade tool designed for precise soldering and reballing of Oppo
and Vivo smartphone motherboards. This stencil ensures accurate solder paste
application or solder ball placement, making motherboard repairs faster and
more reliable.
Features:
- Precise
Solder Application: Perfectly applies solder paste on PCB pads.
- Ideal
for Reballing: Designed for BGA chip re-soldering and repair.
- High-Precision
Apertures: Tiny holes align with PCB pads for uniform solder
deposition.
- Durable
Stainless Steel: Heat-resistant and long-lasting for repeated
professional use.
- Technician
Trusted: Ensures consistent and high-quality results in mobile repair.
Supported Models:
- MT6755V
CPU
- MT6750V
CPU
- Oppo
R9, Oppo A59, Oppo F1s, Oppo A37
- Vivo
Y67, Vivo V5
How to Use:
- Place
the stencil over the motherboard/component.
- Spread
solder paste evenly with a scraper.
- Remove
the stencil carefully to reveal precise solder-applied pads.
- Perform
reflow soldering for secure and professional connections.