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QianLi Mega-Idea QL-06 Black Stencil for Honor / Huawei

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₹175.00

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The QianLi Mega-Idea QL-06 Black Stencil is a precision tool designed for soldering and reballing Honor and Huawei smartphone motherboards. It ensures accurate solder paste application or solder ball placement, making repairs efficient and reliable.

Features:

  • Precise Solder Application: Perfectly deposits solder paste on PCB pads.
  • Ideal for Reballing: Designed for BGA chip re-soldering and repair.
  • High-Precision Apertures: Tiny holes align precisely with PCB pads for uniform solder deposition.
  • Durable Stainless Steel: Heat-resistant, corrosion-resistant, and suitable for repeated professional use.
  • Technician Trusted: Ensures consistent, high-quality results in mobile repair.

Supported Models:

  • Compatible with various Honor and Huawei smartphone models (check specific CPU/chipset compatibility).

How to Use:

  1. Place the stencil over the PCB/component.
  2. Apply solder paste evenly using a scraper.
  3. Carefully remove the stencil to reveal solder-applied pads.

Perform reflow soldering for a secure and professional connection.

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QianLi Mega-Idea QL-06 Black Stencil for Honor / Huawei
₹175.00 ₹0.00
₹175.00