The QianLi Mega-Idea QL-08 Black Stencil is a
professional-grade stencil designed for precise solder paste application and
BGA reballing on Maxim MAX Power devices. It ensures consistent, accurate
soldering for high-quality mobile and electronics repair.
Features:
- Precise
Solder Application: Deposits solder paste accurately on PCB pads.
- Ideal
for Reballing: Perfect for BGA chip re-soldering and component repair.
- High-Precision
Apertures: Tiny holes align with PCB pads for uniform solder
placement.
- Durable
Build: Made of heat-resistant, corrosion-resistant stainless steel for
repeated professional use.
- Technician
Trusted: Delivers consistent, reliable results for mobile repair
experts.
Supported Models:
- Compatible
with Maxim MAX Power devices.
How to Use:
- Place
the stencil over the PCB/component.
- Apply
solder paste evenly using a scraper.
- Carefully
remove the stencil to reveal solder-applied pads.
Perform reflow soldering for a secure,
professional connection.