High-precision stencil designed for accurate solder paste
application on Redmi motherboard pads. Ideal for soldering and reballing
processes, ensuring components like BGA chips are placed and soldered with
precision. Made from durable stainless steel to withstand repeated use and
high-temperature soldering.
Key Features:
Supported Models:
MSM8953 CPU, MSM8917 CPU, Redmi Note 4X, Redmi 4, Redmi 4A, Redmi 5A, Redmi S2,
Redmi Y2, Redmi S2 Pro, Redmi Y2 Pro, Redmi A1, MI MAX2
No review given yet!
You need to Sign in to view this feature
This address will be removed from this list