High-precision stencil designed for accurate solder paste
application on Redmi motherboard pads. Ideal for soldering and reballing
processes, ensuring components like BGA chips are placed and soldered with
precision. Made from durable stainless steel to withstand repeated use and
high-temperature soldering.
Key Features:
Supported Models:
MSM8956 CPU, MT6795 CPU, Redmi Note 2, Redmi Note 3, MI MAX
No review given yet!
You need to Sign in to view this feature
This address will be removed from this list