QianLi Mega-Idea QL-17 Black Stencil for Redmi

QianLi Mega-Idea QL-17 Black Stencil for Redmi

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₹175.00

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Overview
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The QianLi Mega-Idea QL-17 Black Stencil is a professional stencil designed for precise solder paste application and BGA reballing on Redmi and compatible devices. It ensures accurate solder placement, making repairs faster and more reliable.

Features:

Precise Solder Application: Accurately deposits solder paste on PCB pads.
Reballing Ready: Perfect for BGA chip re-soldering and component repair.
High-Precision Apertures: Tiny holes align with PCB pads for uniform solder paste placement.
Durable Material: Made from heat-resistant, corrosion-resistant stainless steel for long-lasting use.
Technician Trusted: Ensures professional results in mobile and electronics repair.

Supported Models:

Qualcomm Snapdragon SDM845 CPU
Redmi 8
Mi MIX2

How to Use:

Place the stencil over the PCB/component.
Apply solder paste evenly using a scraper.
Remove the stencil carefully to reveal solder-applied pads.
Perform reflow soldering for secure connections.

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QianLi Mega-Idea QL-17 Black Stencil for Redmi

₹175.00 ₹0.00

₹175.00