High-precision stencil designed for accurate solder paste
application on Qualcomm CPU pads. Ideal for soldering and reballing processes,
ensuring components like BGA chips are placed and soldered with QL11
Key Features:
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Precision cut apertures for exact pad alignment
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Durable stainless steel construction
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Facilitates both soldering and reballing
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Compatible with specific Qualcomm CPU models
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Easy to clean and reuse
Supported Models:
MSM8992 A, MSM8992 B, MSM8976 A, MSM8976 B, MDM8996 A, MDM8996 B
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