High-precision stencil designed for accurate solder paste
application on Qualcomm CPU pads. Ideal for soldering and reballing processes,
ensuring components like BGA chips are placed and soldered with precision. Made
from durable stainless steel to withstand repeated use and high-temperature
soldering.
Key Features:
Supported Models:
MSM8998 A, MSM8998 B, MSM8953 1A, MSM8953 1B, MSM8953 B01, MSM8916, MSM8937
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