Qianli Mega-Idea QL-23 Black Stencil for Qualcomm CPU

Qianli Mega-Idea QL-23 Black Stencil for Qualcomm CPU

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₹175.00

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Overview
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Enhance your CPU reballing and soldering precision with the Mega-Idea QL-23 Black Stencil, designed specifically for Qualcomm CPUs. Ideal for mobile phone motherboard repair, this stencil ensures accurate application of solder paste or solder balls for professional-grade results.

Features:

Precise Solder Application: Allows accurate placement of solder paste on PCB solder pads.
Reballing Ready: Perfect for re-soldering BGA components with precision.
High-Precision Aperture Design: Tiny holes align with PCB pads to ensure uniform solder deposition.
Durable Material: Made from stainless steel for heat resistance, durability, and repeated use.
Efficient Workflow: Speeds up soldering and minimizes errors during repair.
Professional-Grade: Trusted by technicians for consistent, reliable results.

Supported Models:

MSM8928 A / B
MSM660
MSM8612
MSM7225A
MSM8909
MSM8952
MSM8940

How to Use:

Position the stencil over the PCB/component.
Apply solder paste evenly with a scraper.
Remove the stencil carefully to reveal solder-applied pads.

Reflow solder the component for a secure connection.

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Qianli Mega-Idea QL-23 Black Stencil for Qualcomm CPU

₹175.00 ₹0.00

₹175.00