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Qianli Mega-Idea QL-23 Black Stencil for Qualcomm CPU

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₹175.00

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Enhance your CPU reballing and soldering precision with the Mega-Idea QL-23 Black Stencil, designed specifically for Qualcomm CPUs. Ideal for mobile phone motherboard repair, this stencil ensures accurate application of solder paste or solder balls for professional-grade results.

Features:

  • Precise Solder Application: Allows accurate placement of solder paste on PCB solder pads.
  • Reballing Ready: Perfect for re-soldering BGA components with precision.
  • High-Precision Aperture Design: Tiny holes align with PCB pads to ensure uniform solder deposition.
  • Durable Material: Made from stainless steel for heat resistance, durability, and repeated use.
  • Efficient Workflow: Speeds up soldering and minimizes errors during repair.
  • Professional-Grade: Trusted by technicians for consistent, reliable results.

Supported Models:

  • MSM8928 A / B
  • MSM660
  • MSM8612
  • MSM7225A
  • MSM8909
  • MSM8952
  • MSM8940

How to Use:

  1. Position the stencil over the PCB/component.
  2. Apply solder paste evenly with a scraper.
  3. Remove the stencil carefully to reveal solder-applied pads.

Reflow solder the component for a secure connection.

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Qianli Mega-Idea QL-23 Black Stencil for Qualcomm CPU
₹175.00 ₹0.00
₹175.00