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Qianli Mega-Idea QL-25 Black Stencil for Qualcomm CPU

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₹175.00

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High-precision stencil designed for accurate solder paste application on Qualcomm CPU pads. Ideal for soldering and reballing processes, ensuring components like BGA chips are placed and soldered with precision. Made from durable stainless steel to withstand repeated use and high-temperature soldering.

Key Features:

  • Precision cut apertures for exact pad alignment
  • Durable stainless steel construction
  • Facilitates both soldering and reballing
  • Compatible with multiple Qualcomm CPU layouts
  • Easy to clean and reuse

Supported Models:
Designed for various compatible Qualcomm CPU devices; typically matches component layouts of specific PCB series.

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Qianli Mega-Idea QL-25 Black Stencil for Qualcomm CPU
₹175.00 ₹0.00
₹175.00