Qianli Middle Frame BGA Reballing
Platform is a professional reballing tool designed for iPhone 13 to 13 Pro Max
series. Made with CNC high-precision machining and synthetic stone base, it
ensures stable motherboard positioning, safe high-temperature operation, and
accurate reballing without tilting or slipping.
Features:
- Supports
iPhone 13, 13 Pro, and 13 Pro Max mid-frame reballing
- CNC
precision one-piece machining for stability
- Synthetic
stone platform, heat-resistant and durable
- Magnetic
base for easy stencil placement
- Anti-slip
silicone footbeds for safe operation
- Expandable
and upgradeable design, supports updated models
- Prevents
solder paste wastage by avoiding large mesh carry-away
- Securely
clamps motherboard during high-temperature reballing
Specification:
- Product:
Mega-idea multifunctional mid-frame reballing platform
- Function:
Motherboard repair and reballing
- Material:
Synthetic stone
- Compatible
Devices: iPhone 13 / 13 Pro / 13 Pro Max
How to Use:
- Place
the motherboard on the positioning column according to the model.
- Install
it on the synthetic stone reballing platform.
- Attach
the proper stencil on the magnetic base.
- Apply
low-temperature solder paste evenly.
- Remove
stencil carefully without using hot air directly.
- Heat
the board with a hot air gun until the paste melts.