High-precision reballing platform
designed for iPhone X to 11 Pro Max series logic boards. Built with
CNC-machined one-piece construction and synthetic stone base for heat
resistance and durability. Magnetic base ensures fast stencil placement, while
anti-slip pads keep the platform steady. Expandable design supports additional
models without changing the base.
Features:
- Supports
iPhone X to 11 Pro Max series
- CNC
high-precision machining – stable, tilt-free reballing
- Synthetic
stone platform – durable & heat-resistant
- Magnetic
base – quick stencil positioning
- Dual
silicone anti-slip foot pads – prevents sliding during work
- Secure
motherboard clamping for high-temp reballing
- Prevents
solder paste from dragging or spreading over large mesh areas
- Expandable
system – add new models without replacing the base
Specifications:
- Product:
Mega-Idea multifunctional mid-frame reballing platform
- Function:
Motherboard repair & BGA reballing
- Material:
Synthetic stone + metal CNC frame
- Compatible
Models: iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max
How to Use:
- Place
the motherboard on the positioning column according to the model.
- Fix
the board onto the synthetic stone reballing platform.
- Attach
the correct stencil onto the magnetic base.
- Apply
low-temperature solder paste evenly over the stencil mesh.
- Remove
the stencil carefully (do not blow hot air directly on it).
Use a hot-air gun to heat the board
evenly until the paste melts.