The Qianli QS25 Bumblebee Stencil is a premium reballing stencil crafted for Phone CPU 1 series chipsets. Built with high-quality integrated steel mesh, it delivers precise tin ball alignment, fast heat conduction, and long-lasting durability. Its anti-warping and anti-deformation design ensures stability even under repeated heating, making it the perfect choice for professional IC reballing, CPU repair, and motherboard servicing. Designed to enhance repair efficiency with superior accuracy.
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